Latest News

The latest electronics news, featuring updates and announcements from leading companies in the electronic components industry. Stay informed on product releases, industry trends, and market insights.

Not A Member? Join The Club Now!

Search results for: "anc"

Found 535 result(s)

Clear search

Qualcomm Snapdragon Wear Elite Brings On-Device AI Compute to Power-Constrained Wearables

The Qualcomm Snapdragon Wear Elite platform introduces an NPU for on-device AI, multi-mode connectivity, and power-efficient compute islands to support next-generation wearables that run complex models while maintaining multi-day battery life.

Qualcomm, Snapdragon Wear Elite, wearable SoC, wearable processors, NPU, on device AI, Bluetooth 6, micro power WiFi, UWB, GNSS, NBNTN, low power design, sensor fusion, edge AI, wearable hardware, battery life, embedded systems, smart devices

Nisshinbo NT1199HEAE4S LNA Strengthens Multi-Band GNSS Reception

The Nisshinbo NT1199HEAE4S wideband LNA delivers high linearity, low noise, and stable gain across all major GNSS bands, helping navigation systems maintain accuracy in interference-heavy automotive, industrial, and consumer environments.

Nisshinbo, NT1199HEAE4S, LNA, GNSS, GPS, Galileo, BeiDou, GLONASS, RF front end, low noise amplifier, high linearity, wideband LNA, interference resilience, tracking devices, navigation modules, positioning systems, RF design, active antennas

Molex Cardinal Assemblies Extend Coaxial Testing Into 145 GHz

Molex’s 145 GHz Cardinal multi port coaxial assemblies enable phase matched, low loss connections for next generation AI, 5G and 6G research, offering repeatable high density testing and data characterization up to 448 Gbps.

Molex, Cardinal assemblies, 145GHz testing, high frequency coax, mmWave, 6G research, AI hardware validation, satellite communications, radar systems, coaxial connectors, test and measurement, phase matched assemblies, high data rate test, RF characterization, wideband signal integrity

EPC91122 from EPC Puts GaN Motor Drive Inverter Inside Robotic Joints

EPC’s EPC91122 integrates a complete 3 phase BLDC motor drive inverter inside a compact circular form factor for humanoid joints, combining GaN switching, onboard control, sensing, and communication to deliver high current in limited space.

EPC, EPC91122, EPC33110, GaN inverter, BLDC motor drive, humanoid robotics, integrated motor controller, three phase motor control, GaN power stage, high frequency switching, motion control, robotic joints, servo drive design, compact motor inverters, electromechanical systems, actuator design

Vishay 0201 AEC Q200 Resistors for High Density Designs

Vishay’s CRCW0201 AT 0201 AEC Q200 thick film resistors support high density automotive and industrial designs with stable electrical behavior, predictable drift and reliable assembly performance.

Vishay, CRCW0201 AT, 0201 resistors, thick film resistor, AEC Q200 resistor, high density PCB design, automotive electronics, compact passives, resistor temperature drift, PCB routing constraints, passive component reliability, telecommunications hardware, industrial controllers, snap in assembly, matte tin plating, reflow compatible resistor, high density surface mount design

TDK B43655 and B43656 DC Link Capacitors for EV On-Board Chargers

TDK’s B43655 and B43656 DC link capacitors bring compact sizing, high ripple tolerance and base-cooling optimization to 800V EV on-board chargers, supporting reliable high-power operation.

TDK, B43655, B43656, DC link capacitor, EV chargers, on board charger, OBC capacitor, aluminum electrolytic capacitor, high ripple current, 800V battery systems, base cooling design, forced cooling capacitor, AEC Q200, snap in capacitor, low ESR capacitor, high voltage capacitor, e mobility power, EV power electronics, capacitor thermal performance

Diotec PW4512 1200V 45A Rectifier For Industrial Power

Diotec PW4512 standard recovery rectifier diode offers 1200V reverse voltage, 45A average forward current, 300A surge capability, and TO-247-2L packaging for industrial power supplies, inverters, and protection stages.

Diotec Semiconductor, PW4512, 1200V rectifier diode, 45A silicon diode, standard recovery rectifier, TO-247-2L diode, industrial power rectifier, surge current 300A, inverter diode, motor drive rectifier, UPS rectifier diode, battery charger diode, OR-ing diode, polarity protection diode, high voltage power semiconductor, line frequency rectifier

JAE DW15 Floating Connector Enables Autonomous Robot Charging

JAE DW15 Series floating connector supports autonomous charging of AGVs and AMRs with 60A at 250V DC capability, double-floating misalignment compensation, busbar contact design, and 10,000 mating cycle durability.

JAE, DW15 Series, floating connector, autonomous charging connector, AGV charging, AMR docking connector, 60A DC connector, 250V DC connector, busbar contact, double floating mechanism, robot power connector, warehouse automation hardware, industrial charging system, 10, 000 cycle durability, silver plated contacts, autonomous mobile robots

Samsung HBM4 Ships At 11.7Gbps And 3.3TB/s Per Stack

Samsung begins mass production of HBM4 delivering 11.7Gbps per pin and up to 3.3TB/s per stack with 4nm logic base die, 2,048 I/Os, and improved power efficiency for AI datacenters.

Samsung Electronics, HBM4, high bandwidth memory, 11.7Gbps, 13Gbps headroom, 3.3TB per second, 4nm logic base die, 1c DRAM process, 12-layer stacking, 16-layer HBM, AI datacenter memory, GPU memory bandwidth, TSV technology, power distribution network optimization, HBM3E comparison, hyperscale computing

Could X-Ray Lithography Be The Key To Future Semiconductors

As extreme ultraviolet lithography approaches its physical limits, the semiconductor industry looks beyond EUV toward X-ray lithography and alternative scaling strategies, exposing the growing challenges of sub-nanometer manufacturing.

EUV lithography, extreme ultraviolet, semiconductor manufacturing, chip fabrication, sub-nanometer nodes, X-ray lithography, ASML, Moore’s Law, transistor scaling, advanced packaging, chiplets, die stacking, optical interconnects, future of semiconductors

1 …28 29 30 31 32 …54